IPC 7092A
This document describes the design, materials and assembly challenges associated with implementing embedded circuitry into a printed board. It covers various aspects of embedded circuitry related with the design, selection, processing and testing to achieve a completed multilayered structure that is ready for surface mount and/or through-hole component attachment.
Product Details
- Published:
- 10/01/2022
- ISBN(s):
- 9781638160946
- Number of Pages:
- 124
- File Size:
- 1 file , 8.2 MB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
