IPC 7092

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This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board. It provides useful and practical information to decision makers of formed or placed, passive or active components and helps establish inspection techniques, testing processes, and reliability validations. Users will also learn characteristics that influence the successful implementation of a robust embedded component process.

Product Details

Published:

02/01/2015

ISBN(s):

9781611931747

Number of Pages:

148

File Size:

1 file , 9.4 MB