IPC 2231A
This document provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed board assemblies that utilize surface mount and through hole devices.
Product Details
- Published:
- 08/01/2021
- Number of Pages:
- 60
- File Size:
- 1 file , 1.9 MB
- Product Code(s):
- 2231-STD-0-P-0-EN-A, 2231-STD-0-P-0-EN-A
