IPC 2222

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Establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. This standard applies to single, double or multi-layered boards. Key concepts in this document are: rigid laminate properties, designer/end user materials section map, and scoring parameters. This document should be used in conjunction with IPC- 2221.

Product Details

Published:

03/01/1998

Number of Pages:

24

File Size:

1 file , 900 KB

Product Code(s):

2222(D)1