IPC 2591-Version 1.5
Connected Factory Exchange (CFX)
standard by Association Connecting Electronics Industries, 07/01/2022
Connected Factory Exchange (CFX)
standard by Association Connecting Electronics Industries, 07/01/2022
General Electronic Components Model Based Definition (MBD) Standard
standard by Association Connecting Electronics Industries, 07/01/2022
Rail Transit Addendum to IPC/WHMA-A-620C
Amendment by Association Connecting Electronics Industries, 03/01/2022
Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
standard by Association Connecting Electronics Industries, 04/01/2022
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
standard by Association Connecting Electronics Industries, 02/01/2022
Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 10/01/2021
Guidelines for Acoustic Emission Measurement Method During Mechanical Testing
standard by Association Connecting Electronics Industries, 08/01/2021
Stencil and Misprinted Board Cleaning Handbook
standard by Association Connecting Electronics Industries, 03/01/2022
Design and Critical Process Requirements for Cable and Wiring Harnesses
standard by Association Connecting Electronics Industries, 12/01/2021
Troubleshooting for Printed Board Fabrication Processes
standard by Association Connecting Electronics Industries, 02/01/2022