Time, Temperature and Humidity Stress of Final Board Finish Solderability
standard by Association Connecting Electronics Industries, 05/01/2006

Solderability Evaluation of Printed Boards with Protective Coatings Over Long Term Storage
standard by Association Connecting Electronics Industries, 10/01/1987

Accelerated Aging for Solderability Evaluations
standard by Association Connecting Electronics Industries, 12/01/1987

The Effect of Steam Aging Time and Temperature on Solderability Test Results
standard by Association Connecting Electronics Industries, 01/01/1993

Results of Multilayer Test Program Round Robin
standard by Association Connecting Electronics Industries, 04/01/1981

Dimensional Stability Testing of Thin Laminates-Report on Phase I and Phase II International Round Robin Test Programs – Includes addenda I and II
standard by Association Connecting Electronics Industries, 03/01/1991

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
standard by Association Connecting Electronics Industries, 07/01/2001

Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components
standard by Association Connecting Electronics Industries, 07/01/1993

Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs
standard by Association Connecting Electronics Industries, 09/01/1988

Cleaning and Cleanliness Test Program Phase 1 Test Results
standard by Association Connecting Electronics Industries, 10/01/1989