IPC J-STD-030A
Selection and Application of Board Level Underfill Materials
standard by Association Connecting Electronics Industries, 02/01/2014
Selection and Application of Board Level Underfill Materials
standard by Association Connecting Electronics Industries, 02/01/2014
Printed Circuit Assembly Strain Gage Test Guideline
standard by Association Connecting Electronics Industries, 02/01/2012
IPC/SOLDERTEC International Conference on Lead Free Electronics "Towards Implementation of the RHS Directive" (Brussels, Belgium – June 2003)
Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003
Flexible Circuits Compendium
standard by Association Connecting Electronics Industries,
Standards for Surface Mount Assemblies Manual
standard by Association Connecting Electronics Industries,
Standards for Printed Board Assembly Manual
standard by Association Connecting Electronics Industries,
Rigid Printed Board Manual
Handbook / Manual / Guide by Association Connecting Electronics Industries,
Technology Reference for Design Manual
Handbook / Manual / Guide by Association Connecting Electronics Industries,
Standards for Printed Board Materials Manual
standard by Association Connecting Electronics Industries,
Guidelines for Multichip Module Technology Utilization
standard by Association Connecting Electronics Industries, 08/01/1992