Requirements for Power Conversion Devices for the Computer and Telecommunications Industries
standard by Association Connecting Electronics Industries, 11/01/2012

User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
standard by Association Connecting Electronics Industries, 12/01/2010

User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)
standard by Association Connecting Electronics Industries,

User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
standard by Association Connecting Electronics Industries, 06/01/2016

Mechanical Shock Test Guidelines for Solder Joint Reliability
standard by Association Connecting Electronics Industries, 03/01/2009

Printed Wiring Board Strain Gage Test Guideline
standard by Association Connecting Electronics Industries, 06/01/2005

Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection
standard by Association Connecting Electronics Industries, 12/01/2013

Spherical Bend Test Method for Characterization of Board Level Interconnects
standard by Association Connecting Electronics Industries, 09/01/2011

Test Methods for Characterization of Printed Board Assembly Pad Cratering
standard by Association Connecting Electronics Industries, 12/01/2010

Test Guidelines for Acoustic Emission Measurement during Mechanical Testing
standard by Association Connecting Electronics Industries, 11/01/2013