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Browsing Category: IPC

IPC August 15, 2019

IPC 4204B

Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
standard by Association Connecting Electronics Industries, 08/01/2018

IPC August 15, 2019

IPC 4552

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards, includes Amendment 1 and 2
standard by Association Connecting Electronics Industries, 10/01/2002

IPC August 15, 2019

IPC 4552-WAM1-2

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards with Amendments 1 and 2
standard by Association Connecting Electronics Industries, 12/01/2012

IPC August 15, 2019

IPC 4552A

Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
standard by Association Connecting Electronics Industries, 08/01/2017

IPC August 15, 2019

IPC 4553

Specification for Immersion Silver Plating for Printed Circuit Boards
standard by Association Connecting Electronics Industries, 06/01/2005

IPC August 15, 2019

IPC 4553A

Specification for Immersion Silver Plating for Printed Boards
standard by Association Connecting Electronics Industries, 05/01/2009

IPC August 15, 2019

IPC 4554

Specification for Immersion Tin Plating for Printed Circuit Boards
standard by Association Connecting Electronics Industries, 01/01/2007

IPC August 15, 2019

IPC 4554-WAM1

Specification for Immersion Tin Plating for Printed Circuit Boards with Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2012

IPC August 15, 2019

IPC 4556

Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
standard by Association Connecting Electronics Industries, 01/01/2013