IPC 4101D-WAM1
Specification for Base Materials for Rigid and Multilayer Printed Boards with Amendment 1
standard by Association Connecting Electronics Industries, 07/01/2015
Browsing Category: IPC
IPC 4101E
Specification for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 07/01/2015
IPC 4103
Specification for Base Materials for High Speed/High Frequency Applications
standard by Association Connecting Electronics Industries, 01/01/2002
IPC 4103A
Specification for Base Materials for High Speed/High Frequency Applications
standard by Association Connecting Electronics Industries, 12/01/2011
IPC 4103A-WAM1
Specification for Base Materials for High Speed/High Frequency Applications with Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2014
IPC 4104
Specifications for High Density Interconnect (HDI) and Microvia Materials
standard by Association Connecting Electronics Industries, 05/01/1999
IPC 4203
Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
standard by Association Connecting Electronics Industries, 05/01/2002
IPC 4203A
Cover and Bonding Material for Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 01/01/2013
IPC 4204
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 05/01/2002
IPC 4204A
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 05/31/2012