IPC J-STD-002D

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This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. A test method for the resistance to dissolution/dewetting of metallization is also included in the standard. Intended for use by both vendors and users, J-STD-002D was developed by EIA, IPC and JEDEC.

Product Details

Published:

06/01/2013

Number of Pages:

64

File Size:

1 file , 2 MB